september 2011 doc id 17052 rev 3 1/8 8 EMIF02-MIC07F3 emi filter and esd protection features emi symmetrical (i/o) low-pass filter high efficiency in emi/esd protection lead-free package very thin package high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging complies with the following standards iec 61000-4-2 level 4 (on external pins b1 and c1): ? + 15 kv (air discharge) ? + 8 kv (contact discharge) iec 61000-4-2 level 1 (on external pins): ? + 2 kv (air discharge) ? + 2 kv (contact discharge) applications where emi filtering in es d sensitive equipment is required: mobile phones and communication systems computers, printers and mcu boards description the EMIF02-MIC07F3 chip is a highly integrated audio filter device designed to suppress emi/rfi noise in all systems subjected to electromagnetic interference. this filter includes esd protection circuitry, which prevents damage to the protected device when subjected to esd surges up to 15 kv. tm : ipad is a trademark of stmicroelectronics. figure 1. pin configuration (bump side) lead-free flip-chip package (8 bumps) b c 1 2 3 a mic bias acc_det op on gnd gnd mic2p mic2n www.st.com
characteristics EMIF02-MIC07F3 2/8 doc id 17052 rev 3 1 characteristics figure 2. configuration acc_det pin connection the acc_det pin (accessory detection) is an input pin for the audio pre-amplifier chip which detects the voltage of the microphone line mic2p in case the user presses the on-hook/off- hook button on the headset. when the user selects off-hook using the headset button, the mic2p is shorted to mic2n which is grounded. if your design does not support the acc_det feature, the acc_det pin must be left open (not connected). table 1. absolute ratings (limiting values) symbol parameter and test conditions value unit v pp pins b1 and c1, esd discharge iec 61000-4-2, level 4: air discharge contact discharge pins a2, a3, b3, c3, esd discharge iec 61000-4-2, level 1 air discharge contact discharge 15 8 2 2 kv p d power dissipation at t amb = 25 c 60 mw t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to + 150 c gnd gnd gnd gnd gnd gnd gnd b1 c1 c3 b3 a3 a2 b2 and c2 are g round bumps and must be connected to g ether to asic c12 c11 c21 c22 r11 r21 r31 r22 r12 mic bias mic2p mic2n c31 c32 acc_det
EMIF02-MIC07F3 characteristics doc id 17052 rev 3 3/8 figure 3. electrical characteristics (definitions) table 2. electrical characteristics - values (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 7 v i rm v rm = 3 v per line 50 200 na r 11 1900 2000 2100 r 12 800 1000 1200 r 21 , r 22 1760 2200 2640 r 31 20 25 30 c 11 , c 12 v line = 0 v, v osc = 30 mv, f = 1 mhz (measured under zero light conditions and with bumps b2 and c2 connected together) 0.66 0.83 1 nf c 21 , c 22 11.251.5 c 31 , c 32 7 8.75 10.5 table 3. dynamics characteristics (t amb = 25 c) (1) 1. dynamics characteristics are guarant eed by design and not production tested symbol condition max. value unit ripple between 5 khz and 20 khz 2 db thd+n -21dbv fully differential between micn and micp 1khz 0.009 % symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = forward current i = peak pulse current i = breakdown current v = forward voltage drop r br rm rm rm pp r f v = clamping voltage cl f d = dynamic impedance t = voltage temperature
characteristics EMIF02-MIC07F3 4/8 doc id 17052 rev 3 figure 4. attenuation versus frequency figure 5. attenuation simulation with2 k input and 47 k output 100k 1m 10m 100m 1g -60 -55 -50 -45 -40 -35 -30 -25 -20 100k 1m 10m 100m 1g -60 -55 -50 -45 -40 -35 -30 -25 -20 100k 1m 10m 100m 1g -60 -55 -50 -45 -40 -35 -30 -25 -20 100k 1m 10m 100m 1g -60 -55 -50 -45 -40 -35 -30 -25 -20 s21 (db) f (hz) mic2p mic2n v= 0v bias 10 100 1k 10k 100k 1m 10m 100m 1g -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 s21 (db) input: 2 k output: 47 k ac simulations f (hz) figure 6. analog crosstalk measurement figure 7. esd response to iec 61000-4-2 on one input v (in) and on one output v (out) 1 00 k1m 1 0 m1 00 m1 g -130 -120 -110 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 1 00 k1m 1 0 m1 00 m1 g -130 -120 -110 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 1 00 k1m 1 0 m1 00 m1 g -130 -120 -110 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 crosstalk (db) f (hz) v= 0v bias 5 v/div in 100 ns/div 100 ns/div 100 ns/div 100 ns/div out c2 c3 2 v/div -15 kv air discharge figure 8. esd response to iec 61000-4-2 on one input v (in) and on one output v (out) figure 9. line capacitance versus applied voltage (c11) 5 v/div in 100 ns/div 100 ns/div out c2 c3 2 v/div 100 ns/div 100 ns/div +15 kv air discharge 1000 800 600 400 200 0 0246 v (v) r c (pf)
EMIF02-MIC07F3 ordering information scheme doc id 17052 rev 3 5/8 2 ordering information scheme figure 10. ordering information scheme emif yy - xxx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10 (pf) or 3 letters = application 2 digits = version f = flip chip x = 3: lead-free, pitch = 400 m
package information EMIF02-MIC07F3 6/8 doc id 17052 rev 3 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. flip-chip package dimensions figure 12. footprint recommendations figure 13. marking 1.17 mm 30 m 1.17 mm 30 m 255 m 40 185 m 185 m 400 m 40 400 m 50 605 m 55 220m recommended 220m recommended 260m maxim um solder stencil opening: copper pad diameter: solder mask opening: 300m minimum x y x w z w dot, st logo xx = marking ecopak status yww = datecode (y = year ww = week) z = manufacturing location
EMIF02-MIC07F3 ordering information doc id 17052 rev 3 7/8 figure 14. flip-chip tape and reel specification 4 ordering information note: more information is availa ble in the application notes an2348: ?flip chip: package description and recommendations for use? an1751: ?emi filters: recommendations and measurements? 5 revision history dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.69 1.29 0.22 st st st xxz yww xxz yww xxz yww 1.29 st xxz yww table 4. ordering information order code marking package weight base qty delivery mode EMIF02-MIC07F3 je flip chip 1.8 mg 5000 tape and reel 7? table 5. document revision history date revision changes 16-mar-2010 1 initial release. 12-oct-2010 2 added table 3. 23-sep-2011 3 added acc_det pin connection on page 2 .
EMIF02-MIC07F3 8/8 doc id 17052 rev 3 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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